The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jun. 30, 2020
Applicant:

Landa Labs (2012) Ltd., Rehovot, IL;

Inventors:

Ronny Costi, Gedera, IL;

Gilad Reut Gelbart, Kibbutz Mefalsim, IL;

Assignee:

Landa Labs (2012) LTD., Rehovot, IL;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/0237 (2021.01); H01S 5/02345 (2021.01); H01S 5/02 (2006.01); H01S 5/024 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/0216 (2013.01); H01S 5/0237 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H01S 5/02476 (2013.01); H05K 1/0206 (2013.01); H05K 1/0209 (2013.01); H05K 1/113 (2013.01); H05K 1/118 (2013.01); H05K 3/422 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/073 (2013.01);
Abstract

A method is disclosed for mounting and cooling a circuit component having a plurality of contacts. The method comprises mounting the circuit component on a rigid substrate of a thermally conductive material having and electrically insulating regions with a circuit board arranged between the circuit component and the substrate. The circuit board, which carries conductive traces that terminate in contact pads, is secured to the substrate with at least some of the contact pads on the circuit board disposed on the side of the board facing the substrate, some of which being bonded to the substrate. To establish both an electrical and a thermal connection between the contacts of the circuit component and the contact pads bonded to the substrate, blind holes are formed in the base of the circuit board, each hole terminating at a respective one of the contact pads bonded to the substrate.


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