The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jul. 28, 2021
Applicant:

Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;

Inventor:

Hiroshi Yoshida, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 21/02565 (2013.01); H01L 29/24 (2013.01); H01L 29/66969 (2013.01);
Abstract

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a first electrode layer disposed on the substrate, a gate electrode layer disposed on the first electrode layer, a second electrode layer disposed on the gate electrode layer, an oxide semiconductor layer penetrating through the gate electrode layer, a gate dielectric layer disposed between the gate electrode layer and the oxide semiconductor layer, a first insulating layer disposed between the gate electrode layer and the first electrode layer, and a second insulating layer disposed between the gate electrode layer and the second electrode layer. The oxide semiconductor layer is in direct contact with the first electrode layer and the second electrode layer, respectively.


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