The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Mar. 09, 2021
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventor:

Masayuki Aoike, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H03F 1/56 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/367 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 25/50 (2013.01); H03F 1/56 (2013.01); H03F 3/195 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48145 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

An RF circuit module includes a module substrate, a first substrate in which a first circuit is implemented, and a second substrate in which a second circuit is implemented. The first circuit includes a control circuit that controls an operation of the second circuit. The second circuit includes a radio-frequency amplifier circuit that amplifies an RF signal. The second substrate is mounted on the first substrate. The first substrate is disposed on the module substrate such that a circuit forming surface faces the module substrate. The first substrate and the second substrate have a circuit-to-circuit connection wire that electrically connects the first circuit and the second circuit without intervening the module substrate.


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