The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Jan. 24, 2022
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Tzu-Ching Tsai, Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5283 (2013.01); H01L 23/53228 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/0401 (2013.01);
Abstract
A method for forming an integrated circuit device includes providing a first substrate having a first conductive portion, providing a second substrate having a second conductive portion, performing a first chemical reaction to form a first expanding pad on the first conductive portion to provide a first expanded contact area, performing a second chemical reaction to form a second expanding pad on the second conductive portion to provide a second expanded contact area, and bonding the first substrate to the second substrate with a bonding structure.