The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Dec. 27, 2021
Applicant:
Ablic Inc., Tokyo, JP;
Inventor:
Koji Tsukagoshi, Tokyo, JP;
Assignee:
ABLIC Inc., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 21/56 (2013.01); H01L 23/02 (2013.01); H01L 23/49582 (2013.01); H01L 23/53242 (2013.01); H01L 24/47 (2013.01); H01L 2224/13144 (2013.01); H01L 2924/01079 (2013.01);
Abstract
The present invention provides a small and thin semiconductor device. The semiconductor device flip-chip bonds a semiconductor chipand a leadvia a metal bonding portionand includes a sealing resin covering them. The metal bonding portionis provided with a gold-rich bonding layeron the side of a first electrodeof the semiconductor chipand a gold-rich bonding layeron the side of a second electrodeof the lead, and connection between the semiconductor chipand the leadis strengthened, so that the semiconductor device does not require an anchor portion.