The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Oct. 20, 2020
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Saket Rathi, Tempe, AZ (US);

Shiva K. T. Rajavelu Muralidhar, Tempe, AZ (US);

Siyao Luan, Phoenix, AZ (US);

Alexandros Demos, Scottsdale, AZ (US);

Xing Lin, Chandler, AZ (US);

Assignee:

ASM IP Holding, B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6875 (2013.01); H01L 21/2686 (2013.01); H01L 21/324 (2013.01); H01L 21/67115 (2013.01); H01L 21/67253 (2013.01); H01L 21/68735 (2013.01); H01L 21/67248 (2013.01);
Abstract

A susceptor for semiconductor substrate processing is disclosed herein. In some embodiments, the susceptor may comprise an inner susceptor portion and an outer susceptor portion. The susceptor portions may self-align via complementary features, such as tabs on the outer susceptor and recesses on the inner susceptor portion. The inner susceptor portion may contain several contact pads with which to support a wafer during semiconductor processing. In some embodiments, the contact pads are hemispherical to reduce contact area with the wafer, thereby reducing risk of backside damage. The inner susceptor portion may contain a cavity with which to receive a thermocouple. In some embodiments, the diameter of the cavity is greater than the diameter of the thermocouple such that the thermocouple does not contact the walls of the cavity during processing, thereby providing highly accurate temperature measurements.


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