The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Sep. 20, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Nam Hoon Lee, Hwaseong-si, KR;

Ill Hyun Park, Suwon-si, KR;

Tae Hee Han, Hwaseong-si, KR;

Jin Won Ma, Hwaseong-si, KR;

Byung Joo Oh, Yongin-si, KR;

Bong Ju Lee, Suwon-si, KR;

Jae Hee Lee, Daegu, KR;

Joo Yong Lee, Bucheon-si, KR;

Nam Ki Cho, Seoul, KR;

Chang Seong Hong, Incheon, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/25 (2006.01); H01L 21/268 (2006.01); B23K 26/354 (2014.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); B23K 26/03 (2006.01);
U.S. Cl.
CPC ...
H01L 21/268 (2013.01); B23K 26/032 (2013.01); B23K 26/354 (2015.10); G01N 21/25 (2013.01); H01L 21/67248 (2013.01); H01L 22/12 (2013.01);
Abstract

Provided are a monitoring device and method. A monitoring device includes a laser processor configured to emit a processing laser beam to perform a melting annealing process on a wafer; a laser monitor configured to emit a monitoring laser beam onto the wafer while the laser processor performs the melting annealing process, the laser monitor configured to measure reflectivity of the wafer; and a data processor configured to process data on the reflectivity measured by the laser monitor, and monitor one or more characteristics of the wafer based on the data on the reflectivity.


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