The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Sep. 20, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Bhuvaneshwari Ayyagari, Cupertino, CA (US);

Angada Bangalore Sachid, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/33 (2020.01); G06F 30/3308 (2020.01); G06F 30/20 (2020.01);
U.S. Cl.
CPC ...
G06F 30/3308 (2020.01); G06F 30/20 (2020.01);
Abstract

A complete, unified material-to-systems simulation, design, and verification method for semiconductor design and manufacturing may include evaluating effects of semiconductor material or process changes on software algorithms. The method may include generating primitive circuit structures using the material or process changes; performing an electrical characterization of the primitive circuit structures; providing an output of the electrical characterization to a script to generate compact models; generating a digital system based on the compact models; and evaluating a performance of a software algorithm on the digital system to determine an effect of the material or process change for the semiconductor manufacturing process.


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