The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Dec. 06, 2019
Applicant:

Scholly Fiberoptic Gmbh, Denzlingen, DE;

Inventors:

Patrick Spring, Freiburg, DE;

Johannes Bourbon, Freiburg, DE;

Alexander Kohler, Freiburg, DE;

Matthias Kuhn, Freiburg, DE;

Assignee:

Scholly Fiberoptic GmbH, Denzlingen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H04N 5/225 (2006.01); H04N 5/228 (2006.01); H04N 5/235 (2006.01); H04N 5/374 (2011.01); H04N 7/18 (2006.01); G02B 23/24 (2006.01); G02B 7/02 (2021.01); G02B 7/04 (2021.01); A61B 1/00 (2006.01); A61B 1/04 (2006.01); A61B 1/05 (2006.01); H01R 12/59 (2011.01); H01R 12/67 (2011.01); H01L 27/146 (2006.01); H04N 23/54 (2023.01); H04N 23/50 (2023.01);
U.S. Cl.
CPC ...
G02B 23/2484 (2013.01); H04N 23/54 (2023.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H04N 23/555 (2023.01); H05K 2201/10151 (2013.01); H05K 2201/10734 (2013.01);
Abstract

For the miniaturization of an investigation instrument (), which includes a sensor (), which is arranged in the interior of a long shaft () and is electrically contact-connected by a connection (), it is provided that a flexible bending section () is configured on the connection (), and is thus connected with a contact-connection section (), which is contact-connected with contacts () of the sensor () on the reverse side such that, firstly, the entire connection () is arranged in the shadow of the image sensor () and, secondly, the bending section () originates from the contact-connection section () within a field () which is subtended by the reverse-side contacts () of the sensor ().


Find Patent Forward Citations

Loading…