The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Oct. 30, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Yousuke Irie, Nara, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/24 (2006.01); G01K 3/10 (2006.01); G01J 5/00 (2022.01); H04N 5/33 (2023.01); H04N 7/18 (2006.01); G01B 11/16 (2006.01); G01L 1/00 (2006.01); G01M 5/00 (2006.01); G01N 25/20 (2006.01); G01N 25/72 (2006.01); G01M 99/00 (2011.01); G01M 11/08 (2006.01);
U.S. Cl.
CPC ...
G01L 1/248 (2013.01); G01B 11/16 (2013.01); G01J 5/0003 (2013.01); G01K 3/10 (2013.01); G01L 1/00 (2013.01); G01M 5/0008 (2013.01); G01M 5/0091 (2013.01); G01M 11/081 (2013.01); G01M 99/002 (2013.01); G01N 25/20 (2013.01); G01N 25/72 (2013.01); H04N 5/33 (2013.01); H04N 7/181 (2013.01); G01J 2005/0077 (2013.01);
Abstract

A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.


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