The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

May. 03, 2021
Applicants:

The Regents of the University of Michigan, Ann Arbor, MI (US);

Universal Display Corporation, Ewing, NJ (US);

Inventors:

Stephen Forrest, Ann Arbor, MI (US);

Gregory McGraw, Ann Arbor, MI (US);

Siddharth Harikrishna Mohan, Plainsboro, NJ (US);

Diane L. Peters, Ann Arbor, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/12 (2006.01); C23C 14/22 (2006.01); C23C 14/24 (2006.01);
U.S. Cl.
CPC ...
C23C 14/12 (2013.01); C23C 14/228 (2013.01); C23C 14/243 (2013.01); Y10T 137/85938 (2015.04);
Abstract

A microfluidic device for use with a microfluidic delivery system, such as an organic vapor jet printing device, includes a glass layer that is directly bonded to a microfabricated die and a metal plate via a double anodic bond. The double anodic bond is formed by forming a first anodic bond at an interface of the microfabricated die and the glass layer, and forming a second anodic bond at an interface of the metal plate and the glass layer, where the second anodic bond is formed using a voltage that is lower than the voltage used to form the first anodic bond. The second anodic bond is formed with the polarity of the voltage reversed with respect to the glass layer and the formation of the first anodic bond. The metal plate includes attachment features that allow removal of the microfluidic device from a fixture.


Find Patent Forward Citations

Loading…