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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11760876 B1

PDFFull Text
Date of Patent:
Sep. 19, 2023

Filed:

Oct. 29, 2021

Resin composition and article made therefrom

Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventors:

Chen-Yu Hsieh, Taoyuan, TW;

Chih-Wei Lin, Taoyuan, TW;

Ching Lo, Taoyuan, TW;

Assignee:

ELITE MATERIAL CO., LTD., Taoyuan, TW;

Attorney:

MUNCY, GEISSLER, OLDS & LOWE, P.C.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C08L 85/02 (2006.01); C08L 79/08 (2006.01); C08L 71/12 (2006.01); C08L 25/10 (2006.01); C08J 5/24 (2006.01); B32B 27/18 (2006.01); B32B 5/08 (2006.01); C08L 71/00 (2006.01); C09J 7/30 (2018.01); C09J 171/00 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); B32B 5/26 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
C08L 71/00 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08J 5/244 (2021.05); C09J 7/30 (2018.01); C09J 171/00 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/206 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); C08J 2371/12 (2013.01); C08J 2409/00 (2013.01); C08J 2409/06 (2013.01); C08J 2479/08 (2013.01); C09J 2400/14 (2013.01); C09J 2400/163 (2013.01); C09J 2423/00 (2013.01); C09J 2471/00 (2013.01); C09J 2479/08 (2013.01);
Abstract

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

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