The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Jan. 23, 2019
Applicant:
Nagase Chemtex Corporation, Osaka, JP;
Inventors:
Yosuke Oi, Hyogo, JP;
Takashi Hiraoka, Hyogo, JP;
Assignee:
NAGASE CHEMTEX CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08K 3/36 (2006.01); C08K 5/06 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/42 (2013.01); C08G 59/50 (2013.01); C08G 59/621 (2013.01); C08K 3/36 (2013.01); C08K 5/06 (2013.01); C08K 7/18 (2013.01); C08L 2203/206 (2013.01);
Abstract
An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated. In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided. Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.