The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2023

Filed:

Jun. 10, 2021
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Roberto Brioschi, Austin, TX (US);

Benyamin Gholami Bazehhour, Redwood City, CA (US);

Milena Vujosevic, San Jose, CA (US);

Kazunori Hayata, Cupertino, CA (US);

Assignee:

InvenSense, Inc., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/00325 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0271 (2013.01); B81B 2201/042 (2013.01); B81B 2207/012 (2013.01);
Abstract

A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.


Find Patent Forward Citations

Brioschi, Roberto. (2023). Mems stress reduction structure embedded into package (U.S. Patent No. 11760627). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11760627

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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