The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Apr. 23, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Kazuki Ishida, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
Kohei Muto, Tokyo, JP;
Akihito Suzuki, Tokyo, JP;
Kenji Murakami, Tokyo, JP;
Tsuyoshi Okawara, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
This mold for prepreg lamination includes a first surface only having a surface flat along one direction; second surfaces having a surface flat along the one direction and disposed at a predetermined angle with respect to the first surface; and a third surface with a cross-sectional shape, which is a surface yielded from a cut in an orthogonal direction to the one direction, that is an arc, and with one end side connected to the first surface and the other end side connected to the second surface. First bend sections having a protruding shape are formed on the second surface and the third surface and serve as boundaries, and one of the surfaces is slanted relative to the other surfaces. On the third surface, the diameter of the arc on the other surface becomes gradually smaller as further away from the first bend section along the one direction.