The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Nov. 24, 2020
Applicant:
Linxens Holding, Mantes la Jolie, FR;
Inventor:
Carsten Nieland, Dresden, DE;
Assignee:
LINXENS HOLDING, Mantes-la-Jolie, FR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B23K 1/00 (2006.01); B32B 15/04 (2006.01); B32B 27/06 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B29C 65/02 (2006.01); B29C 65/18 (2006.01); B32B 37/10 (2006.01); B42D 25/455 (2014.01); B42D 25/46 (2014.01); B23K 101/42 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B23K 1/0016 (2013.01); B29C 65/02 (2013.01); B29C 65/18 (2013.01); B32B 15/04 (2013.01); B32B 27/06 (2013.01); B32B 27/304 (2013.01); B32B 27/365 (2013.01); B32B 37/10 (2013.01); B42D 25/455 (2014.10); B42D 25/46 (2014.10); B23K 2101/42 (2018.08); H05K 1/0393 (2013.01);
Abstract
When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.