The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2023
Filed:
Jun. 16, 2021
Applicant:
SK Enpulse Co., Ltd., Gyeonggi-do, KR;
Inventors:
Jae In Ahn, Gyeonggi-do, KR;
Kyung Hwan Kim, Gyeonggi-do, KR;
Sung Hoon Yun, Gyeonggi-do, KR;
Jang Won Seo, Gyeonggi-do, KR;
Kang Sik Myung, Gyeonggi-do, KR;
Assignee:
SK ENPULSE CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24D 18/00 (2006.01); H01L 21/3105 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24D 18/0009 (2013.01); C09G 1/02 (2013.01); H01L 21/31053 (2013.01);
Abstract
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.