The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Sep. 06, 2018
Applicant:
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Hubei, CN;
Inventor:
Yun Li, Hubei, CN;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 50/80 (2023.01); B32B 3/26 (2006.01); B32B 3/28 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); G09F 9/30 (2006.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 50/80 (2023.02); B32B 3/266 (2013.01); B32B 3/28 (2013.01); B32B 7/12 (2013.01); B32B 15/04 (2013.01); G09F 9/301 (2013.01); H10K 77/111 (2023.02); B32B 2457/206 (2013.01); H10K 2102/311 (2023.02);
Abstract
A bendable backplane structure is provided. The bendable backplane structure includes a first flexible layer, and a metal layer which is disposed on the first flexible layer and includes a first metal section and a second metal section, wherein the first metal section includes a first extension, the second metal section includes a second extension, and the first extension is disposed corresponding to the second extension in a lamination direction from the first flexible layer toward the metal layer. The bendable backplane further also includes a second flexible layer which is disposed on the metal layer.