The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Mar. 09, 2021
Applicant:
Auras Technology Co., Ltd., New Taipei, TW;
Inventors:
Chien-An Chen, New Taipei, TW;
Chien-Yu Chen, New Taipei, TW;
Wei-Hao Chen, New Taipei, TW;
Bo-Zhang Chen, New Taipei, TW;
Chun-Chi Lai, New Taipei, TW;
Yun-Kuei Lin, New Taipei, TW;
Assignee:
AURAS TECHNOLOGY CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 21/00 (2006.01); F28F 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01);
Abstract
A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.