The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Jul. 22, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Shinho Yoon, Suwon-si, KR;

Jonghyuck Lee, Suwon-si, KR;

Taeik Kim, Suwon-si, KR;

Haeyeon Kim, Suwon-si, KR;

Dongjun Oh, Suwon-si, KR;

Soonho Hwang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H01Q 1/22 (2006.01); H01Q 1/36 (2006.01); H01Q 1/50 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01); H05K 5/03 (2006.01); H05K 7/14 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0226 (2013.01); H01Q 1/22 (2013.01); H01Q 1/36 (2013.01); H01Q 1/50 (2013.01); H05K 1/181 (2013.01); H05K 5/0017 (2013.01); H05K 5/03 (2013.01); H05K 7/1427 (2013.01); H04M 1/0268 (2013.01); H05K 2201/10098 (2013.01);
Abstract

An electronic device is provided. The electronic device includes a first housing structure including a conductive first side member, a second housing structure including a conductive second side member, a hinge structure rotatably connecting the first housing structure and the second housing structure, and a printed circuit board. The first side member or the second side member may include a first side face, a second side face, a third side face, a fourth side face, a first slit formed in the fourth side face, and a second slit formed in any one of the first side face, the second side face, and the third side face. At least a part of the second side face or the third side face between the first slit and the second slit may be made of a conductive material and electrically connected to the printed circuit board as a radiating conductor.


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