The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Apr. 05, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Sang Hoon Kim, Suwon-si, KR;

Yong Duk Lee, Suwon-si, KR;

Duck Young Maeng, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H05K 2201/09563 (2013.01);
Abstract

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.


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