The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Apr. 12, 2019
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Bojie Zhao, Zhejiang, CN;

Dongli Yuan, Zhejiang, CN;

Zhen Huang, Zhejiang, CN;

QiMin Mei, Zhejiang, CN;

Zhenyu Chen, Zhejiang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/54 (2023.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); G03B 17/02 (2021.01);
U.S. Cl.
CPC ...
H04N 23/54 (2023.01); G03B 17/02 (2013.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01);
Abstract

This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.


Find Patent Forward Citations

Quick Actions:

Zhao, Bojie. (2023). Camera module having chamfer, photosensitive assembly, preparation method, and electronic device (U.S. Patent No. 11758253). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11758253

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…