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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11757076 B1

PDFFull Text
Date of Patent:
Sep. 12, 2023

Filed:

Nov. 14, 2022

Light source module and display panel using the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Chigoo Kang, Seoul, KR;

Seogho Lim, Seongnam-si, KR;

Ilseop Won, Hwaseong-si, KR;

Jungwoo Lee, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Lee IP Law, P.C.

Primary Examiner:

Feifei Yeung Lopez

Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/38 (2010.01); H01L 33/10 (2010.01); G02F 1/13357 (2006.01); H01L 27/146 (2006.01); F21V 5/04 (2006.01); G02B 19/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); F21V 5/04 (2013.01); G02B 19/0014 (2013.01); G02B 19/0066 (2013.01); G02F 1/133606 (2013.01); H01L 27/14627 (2013.01); H01L 27/156 (2013.01); H01L 33/10 (2013.01); H01L 33/387 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light source module includes a circuit board, light emitting diode chips on an upper surface of the circuit board, the light emitting diode chips being spaced apart and each emitting blue light and having a first surface facing the upper surface of the circuit board, a second surface opposite the first surface, and first and second electrodes on the first surface, a first multilayer reflective structure on the second surface and including a plurality of alternately stacked insulating layers having different refractive indices, and a lens respectively covering each of the light emitting diode chips and contacting the upper surface of the circuit board at an acute contact angle, the lens having a thickness of 2.5 mm or less from the upper surface of the circuit board, and a contact region with the upper surface of the circuit board with a diameter of 1 mm to 3 mm.

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