The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Mar. 24, 2020
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventor:
Shengguang Ban, Beijing, CN;
Assignee:
BOE Technology Group Co., Ltd., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/105 (2006.01); H01L 31/101 (2006.01); H01L 31/20 (2006.01); G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
H01L 31/1055 (2013.01); H01L 31/1016 (2013.01); H01L 31/202 (2013.01); G06V 40/1318 (2022.01);
Abstract
A photosensitive sensor, a manufacturing method thereof and a display panel are provided. The photosensitive sensor includes a first type semiconductor layer, an intrinsic semiconductor layer disposed on a side of the first type semiconductor layer, and a second type semiconductor layer disposed on a side of the intrinsic semiconductor layer away from the first type semiconductor layer. The intrinsic semiconductor layer is provided with metal particles capable of generating a surface plasmon effect. The metal particles are dispersely distributed in the intrinsic semiconductor layer.