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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11756982 B1

PDFFull Text
Date of Patent:
Sep. 12, 2023

Filed:

Sep. 20, 2021

Methods of parallel transfer of micro-devices using mask layer

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Manivannan Thothadri, Mountain View, CA (US);

Arvinder Chadha, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:

Fish & Richardson P.C.

Primary Examiner:

Jack S Chen

Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/60 (2010.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 33/20 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/60 (2013.01); H05K 3/0026 (2013.01); H05K 3/305 (2013.01); H05K 13/0015 (2013.01); H05K 13/0069 (2013.01); H05K 13/0469 (2013.01); H01L 33/20 (2013.01); H01L 33/48 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A method of transferring micro-devices includes attaching micro-devices to one surface of a first body with a first adhesive layer, and selectively forming a masking layer on an opposite surface of the first body. A second adhesive layer on a second body is placed to contact the plurality of micro-devices. The first adhesive layer is exposed to illumination through the first body to create a neutralized portion while the masking layer blocks the illumination from reaching some of first adhesive layer to provide a less exposed portion that is more adhesive than the neutralized portion. The first surface is separated from the second surface such micro-devices on the less exposed portion of the first adhesive layer remain attached to the first surface and micro-devices corresponding to the neutralized portion attach to the second body and separate from the first surface.

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