The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Jul. 21, 2020
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Wan-Ying Sau, Bayan Lepas, MY;

Ronald Johannes Bonne, Plainfield, IL (US);

Zhi Hua Song, Palo Alto, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2023.01); H01L 25/16 (2023.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 25/00 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92127 (2013.01);
Abstract

Light-emitting devices are described herein. A device includes a packaging substrate having a top surface and a bottom surface and a hybridized device having a bottom surface on the top surface of the packaging substrate. The hybridized device includes a silicon backplane that includes input/output (I/O) pins and a light-emitting diode (LED) array having a bottom surface on a top surface of the silicon backplane. Passive components are disposed on the top surface of the packaging substrate. Conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.


Find Patent Forward Citations

Loading…