The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Dec. 20, 2021
Tokyo Institute of Technology, Tokyo, JP;
Takayuki Ohba, Tokyo, JP;
TOKYO INSTITUTE OF TECHNOLOGY, Tokyo, JP;
Abstract
A method for manufacturing a semiconductor device is provided. In the method, first substrate is prepared. Each of the first substrates has first product regions. The first substrates are stacked, thereby electrically connecting different layers of the first substrates via a through-electrode. A second substrates having second product regions is prepared. Second semiconductor chips are attached to the second product regions. The second semiconductor chips are attached to the second substrate on a top layer of the first substrates. The second substrate is removed from the second semiconductor chips. First electrode pads of the top layer are electrically connected to second electrode pads of the second semiconductor chips via through-electrodes. The second semiconductor chips are connected to each other in parallel. The first and second product regions are separated, thereby manufacturing semiconductor chip stacks including more semiconductor chips in the top layer than the other layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile