The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Sep. 30, 2020
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Siho Choi, Seoul, KR;

Seongmoo Cho, Seoul, KR;

Oksun Yu, Seoul, KR;

Kwangsoo Kim, Seoul, KR;

Gun Lee, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49579 (2013.01); H05K 7/026 (2013.01);
Abstract

A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.


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