The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Jan. 04, 2021
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Sheng-Che Hung, Hsinchu County, TW;

Shih-Hsien Wu, Taoyuan, TW;

Yu-Wei Huang, Chiayi, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/485 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/485 (2013.01); H05K 1/114 (2013.01); H05K 1/115 (2013.01); H05K 3/303 (2013.01); H05K 3/421 (2013.01); H05K 2201/09609 (2013.01);
Abstract

An electronic device having a substrate includes a substrate and at least one outer layer. The substrate has a plurality of first vias. The outer layer has a plurality of second vias. The outer layer is disposed on a side of the substrate. The first vias have a larger distribution density or quantity than the second vias so that a portion of the first vias are electrically connected to the second vias, and a portion of the first vias are electrically floating.


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