The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
May. 12, 2022
Applicant:
Cisco Technology, Inc., San Jose, CA (US);
Inventors:
Ashley J. M. Erickson, Danville, CA (US);
Matthew J. Traverso, Saratoga, CA (US);
Sandeep Razdan, Burlingame, CA (US);
Joyce J. M. Peternel, Morgan Hill, CA (US);
Aparna R. Prasad, San Jose, CA (US);
Assignee:
Cisco Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4803 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2221/68345 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/32225 (2013.01);
Abstract
An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.