The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

May. 13, 2020
Applicant:

Toppan Printing Co., Ltd., Tokyo, JP;

Inventor:

Tetsuyuki Tsuchida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); H01L 23/15 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H05K 1/0306 (2013.01); H05K 1/11 (2013.01); H05K 3/46 (2013.01); H05K 1/116 (2013.01); H05K 1/18 (2013.01);
Abstract

A glass core, a multilayer circuit board, and a method of manufacturing a glass core that appropriately form copper wiring, and suppresses crack and the like, a glass core includes: a glass plate; a first metal layer provided on the glass plate; a first electrolytic copper plating layer provided on the first metal layer; a dielectric layer provided above the first electrolytic copper plating layer; a second metal layer provided on the dielectric layer; an electroless nickel plating layer provided on the second metal layer and having a phosphorus content of less than 5 mass %; and a second electrolytic copper plating layer provided on the electroless nickel plating layer.


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