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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11756845 B1

PDFFull Text
Date of Patent:
Sep. 12, 2023

Filed:

Feb. 13, 2019

Copper foil with glass carrier and production method therefor

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Yoshinori Matsuura, Ageo, JP;

Takenori Yanai, Ageo, JP;

Toshimi Nakamura, Ageo, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Lauren R Colgan

Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); C03C 17/09 (2006.01); C03C 17/36 (2006.01); C23C 14/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); B32B 15/04 (2013.01); C03C 17/09 (2013.01); C03C 17/3639 (2013.01); C23C 14/185 (2013.01); H01L 21/4846 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/09 (2013.01); C03C 2218/154 (2013.01);
Abstract

A glass carrier-attached copper foil is provided that can achieve a desired circuit mounting board that reduces separation of a copper layer at the cut edge even if the copper foil is downsized to dimensions enabling mount of a circuit, and has an intended circuit pattern with a fine pitch. The glass carrier-attached copper foil includes a glass carrier, a release layer, and a copper layer with a thickness of 0.1 to 3.0 μm. The glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 μm as measured in accordance with JIS B 0601-2001 and a rough region having a maximum height Rz of 1.0 to 30.0 μm as measured in accordance with JIS B 0601-2001. The rough region has a pattern of lines that define the flat regions.

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