The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Oct. 28, 2020
Applicant:
Semes Co., Ltd., Cheonan-si, KR;
Inventors:
Yong Jun Seo, Hwaseong-si, KR;
Sang Hyun Son, Busan, KR;
Sang Min Ha, Daegu, KR;
Dong Ok Ahn, Hwaseong-si, KR;
Assignee:
SEMES CO., LTD., Cheonan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/324 (2006.01); G01P 15/02 (2013.01); G01C 19/00 (2013.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); G01C 19/00 (2013.01); G01P 15/02 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 23/4985 (2013.01); H01L 23/562 (2013.01);
Abstract
Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.