The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Apr. 23, 2020
Applicant:
Tcl China Star Optoelectronics Technology Co., Ltd., Guangdong, CN;
Inventor:
Yuan Mei, Guangdong, CN;
Assignee:
TCL China Star Optoelectronics Technology Co., Ltd., Guangdong, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/32 (2006.01); H01L 21/3213 (2006.01); H01L 27/12 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 27/124 (2013.01); H01L 27/1288 (2013.01); G02F 1/1368 (2013.01);
Abstract
A etching method of a copper-molybdenum film and an array substrate are provided. The etching method of a copper-molybdenum film includes forming a copper-molybdenum film on a substrate; forming a photoresist in a predetermined pattern on the copper-molybdenum film; etching a copper film of the copper-molybdenum film with an acidic first etching solution; etching a molybdenum film of the copper-molybdenum film with a neutral or basic second etching solution, to form the copper-molybdenum film in the predetermined pattern.