The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Sep. 27, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Chan Yoon, Suwon-si, KR;

Dong Hwan Lee, Suwon-si, KR;

Dong Jin Lee, Suwon-si, KR;

Young Ghyu Ahn, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 41/10 (2013.01); H01F 2027/2809 (2013.01);
Abstract

A coil electronic component includes a support substrate; first and second coil patterns disposed on an upper surface and a lower surface of the support substrate, respectively; an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant, wherein at least one portion of a lower surface of the first coil pattern is exposed from the encapsulant, at least one portion of a lower surface of the second coil pattern is exposed from the encapsulant, and the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern.


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