The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Jan. 07, 2021
Applicant:
Leica Microsystems Cms Gmbh, Wetzlar, DE;
Inventors:
Falk Schlaudraff, Butzbach, DE;
Christoph Greb, Marburg, DE;
Assignee:
LEICA MICROSYSTEMS CMS GMBH, Wetzlar, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G06T 7/0014 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/10148 (2013.01); G06T 2207/30024 (2013.01);
Abstract
A method for checking a dissection process in a laser microdissection system includes carrying out the dissection process for cutting out a dissectate from an object in a first region of the object by a laser beam. First image data is acquired of at least the first region of the object after the dissection process. It is examined whether the first image data has sharp structures within a region to be separated by the dissection process in order to determine whether the dissection process was successful.