The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Mar. 09, 2022
Applicant:

Southeast University, Nanjing, CN;

Inventors:

Peng Cao, Nanjing, CN;

Kai Wang, Nanjing, CN;

Tai Yang, Nanjing, CN;

Wei Bao, Nanjing, CN;

Assignee:

SOUTHEAST UNIVERSITY, Jiangsu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/367 (2020.01); G06N 3/0442 (2023.01); G06N 3/0464 (2023.01); G06N 3/045 (2023.01); G06F 119/06 (2020.01); G06F 119/12 (2020.01);
U.S. Cl.
CPC ...
G06F 30/367 (2020.01); G06N 3/045 (2023.01); G06N 3/0442 (2023.01); G06N 3/0464 (2023.01); G06F 2119/06 (2020.01); G06F 2119/12 (2020.01);
Abstract

Disclosed in the present invention is a method for predicting a delay at multiple corners for a digital integrated circuit, which is applicable to the problem of timing signoff at multiple corners. In the aspect of feature engineering, a path delay relationship at adjacent corners is extracted by using a dilated convolutional neural network (Dilated CNN), and learning is performed by using a bi-directional long short-term memory model (Bi-directional Long Short-Term Memory, BLSTM) to obtain topology information of a path. Finally, prediction results of a path delay at a plurality of corners are obtained by using an output of a multi-gate mixture-of-experts network model (Multi-gate Mixture-of-Experts, MMoE). Compared with a conventional machine learning method, the present invention can achieve prediction with higher precision through more effective feature engineering processing in a case of low simulation overheads, and is of great significance for timing signoff at multiple corners of a digital integrated circuit.


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