The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Mar. 26, 2021
Accelink Technologies Co., Ltd., Wuhan, CN;
Abstract
Provided is a multi-channel light-receiving module, which comprises an incident collimator, a light-splitting assembly, an optical path conversion assembly and a photoelectric chip array which are arranged in sequence, wherein the light-splitting assembly comprises an inner reflector and a plurality of optical filters, and the optical filters are respectively arranged on an output end of the inner reflector; the channel interval of photoelectric chips in the photoelectric chip array is less than the channel interval of an adjacent optical filter; the optical path conversion assembly comprises a plurality of emergent collimators and an optical fiber connected to each of the emergent collimators; a plurality of paths of optical signals output by the light-splitting assembly are respectively coupled into corresponding optical fibers after passing through the plurality of emergent collimators; and the plurality of paths of optical signals are output by output ends of the plurality of optical fibers and are then coupled to the photoelectric chip array. By means of the light-receiving module, an optical path component is converted into a small channel interval of photoelectric chips from a large channel interval of optical filters, the problem of it being difficult to match the channel interval of optical filters and the channel interval of photoelectric chips is solved, the cost of photoelectric chips is reduced, and the assembly difficulty of optical filters is also reduced.