The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Feb. 11, 2021
Applicants:

Jeonju University Office of Industry-university Cooperation, Jeonju-si, KR;

Hun Jeong, Jeonju-si, KR;

Inventors:

Hong-gun Kim, Seoul, KR;

Hun Jeong, Jeonju-si, KR;

Leeku Kwac, Jeonju-si, KR;

Seonghun Back, Jeollabuk-do, KR;

Bobby Singh Soram, Jeonju-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/18 (2006.01); C23C 18/38 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C23F 1/10 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1893 (2013.01); C23C 18/1657 (2013.01); C23C 18/38 (2013.01); C23F 1/10 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

Provided is a method of preparing a nanocomposite material plated with a network-type metal layer through silica self-cracks and a wearable electronics carbon fiber prepared therefrom. The present disclosure provides a nanocomposite material having excellent electrical conductivity and bending resistance by plating a network-type metal layer on a substrate having a flat surface and/or a curved surface through a method of preparing the nanocomposite material in which the network-type metal layer is plated on silica self-cracks by applying a silica coating solution on the substrate having a flat or curved surface, performing drying after the applying of the silica coating solution to form the silica self-cracks having random crack directions and sizes, and performing electroless metal plating on the surface of the substrate. Further, the present disclosure provides a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance.


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