The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2023
Filed:
Oct. 18, 2022
Applicant:
Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;
Inventors:
Assignee:
Tanaka Kikinzoku Kogyo K.K., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/02 (2006.01); C22F 1/08 (2006.01); C22C 9/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 9/00 (2013.01); H01B 1/026 (2013.01); H01R 13/02 (2013.01);
Abstract
A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.