The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Apr. 30, 2020
Applicant:

Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;

Inventors:

Xingxing Yao, Kunshan, CN;

Rongtao Wang, Kunshan, CN;

Ningning Jia, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08L 83/04 (2006.01); C08L 33/10 (2006.01); C08J 5/18 (2006.01); H05K 1/09 (2006.01); C08L 37/00 (2006.01); C08J 5/24 (2006.01); C08K 5/00 (2006.01); C08K 3/013 (2018.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08J 5/18 (2013.01); C08J 5/244 (2021.05); C08J 5/246 (2021.05); C08L 33/10 (2013.01); C08L 37/00 (2013.01); C08L 83/04 (2013.01); H05K 1/095 (2013.01); C08J 2333/10 (2013.01); C08J 2337/00 (2013.01); C08J 2363/00 (2013.01); C08J 2383/04 (2013.01); C08K 3/013 (2018.01); C08K 5/0025 (2013.01); C08K 5/0066 (2013.01); C08L 2207/53 (2013.01); H05K 1/188 (2013.01);
Abstract

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.


Find Patent Forward Citations

Loading…