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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11753542 B1

PDFFull Text
Date of Patent:
Sep. 12, 2023

Filed:

Dec. 29, 2020

Thermoplastic resin composition

Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Inventor:

Seung Woo Choi, Seoul, KR;

Assignees:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Attorney:

Fox Rothschild LLP

Primary Examiner:

Ana L Woodward

Int. Cl.
CPC ...
C08L 77/06 (2006.01); C08L 23/06 (2006.01); C08L 23/08 (2006.01); C08L 23/16 (2006.01); C08L 51/06 (2006.01); C08L 77/02 (2006.01); C08K 3/22 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08K 3/22 (2013.01); C08K 3/38 (2013.01); C08L 23/06 (2013.01); C08L 23/0815 (2013.01); C08L 23/16 (2013.01); C08L 51/06 (2013.01); C08L 77/02 (2013.01); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/005 (2013.01); C08L 2201/08 (2013.01); C08L 2203/30 (2013.01); C08L 2205/035 (2013.01); C08L 2205/24 (2013.01); C08L 2207/04 (2013.01);
Abstract

Disclosed are a thermoplastic polyamide resin composition, a method for preparing the same and a molded article produced thereby. The molded article may have improved impact strength and heat resistance, produced from the thermoplastic polyamide resin composition including a nucleating agent containing an aromatic polyamide and a heat-dissipation filler, polyamide 66 and polyamide 6, thereby improving the speed of process and realize uniform crystallization.

Find Patent Forward Citations

Choi, Seung. (2023). Thermoplastic resin composition (U.S. Patent No. 11753542). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11753542

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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