The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Oct. 01, 2020
Applicant:

Ascend Performance Materials Operations Llc, Houston, TX (US);

Inventors:

Jacob G. Ray, Pace, FL (US);

Tiffany Hristopoulos, Jacksonville, FL (US);

Steven C. Manning, Pensacola, FL (US);

Tariq S. Oweimreen, Sterling Heights, MI (US);

Scott E. Powers, Rockford, MI (US);

Askim Senyurt, Beaverton, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/36 (2006.01); B32B 27/08 (2006.01); C08J 5/18 (2006.01); C08G 69/26 (2006.01); B32B 27/18 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); C08L 77/06 (2006.01); B32B 7/12 (2006.01); C08K 3/36 (2006.01); C08K 5/098 (2006.01); C08K 5/20 (2006.01);
U.S. Cl.
CPC ...
C08G 69/36 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); C08G 69/265 (2013.01); C08J 5/18 (2013.01); C08K 3/36 (2013.01); C08K 5/098 (2013.01); C08K 5/20 (2013.01); C08L 77/06 (2013.01); B32B 2250/24 (2013.01); B32B 2250/44 (2013.01); B32B 2307/406 (2013.01); B32B 2307/412 (2013.01); B32B 2307/518 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7244 (2013.01); B32B 2439/70 (2013.01); C08J 2377/06 (2013.01);
Abstract

A copolyamide composition comprising a statistical copolyamide containing 70-99 wt % of diamine and dicarboxylic acid repeat units and 1-30 wt % of lactam or AA-BB repeat units, whereby incorporation of the comonomer lactam or AA-BB unit reduces the crystallization rate (longer crystallization times) while maintaining (1) high melting point, (2) low potential plate out, (3) low oxygen permeation, (4) high tensile strength and (5) puncture/tear resistance.


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