The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Dec. 29, 2021
Applicant:

Kolektor Group D.o.o., Idrija, SI;

Inventors:

Ana Drmota Petric, Idrija, SI;

Zmago Jereb, Idrija, SI;

Ludvik Kumar, Logatec, SI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 5/02 (2006.01); H02K 15/14 (2006.01); H02K 7/00 (2006.01); H02K 11/00 (2016.01); B29C 45/14 (2006.01); B23K 26/364 (2014.01); B23K 26/08 (2014.01); B23K 101/38 (2006.01); B29K 705/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14221 (2013.01); B23K 26/0823 (2013.01); B23K 26/364 (2015.10); H02K 5/02 (2013.01); H02K 15/14 (2013.01); B23K 2101/38 (2018.08); B29K 2705/00 (2013.01); B29K 2995/0005 (2013.01); B29L 2031/34 (2013.01);
Abstract

A method is provided for the production of an electrical or electronic component having a conductor element with two contact points and a plastic structure injection-molded thereon. A strip-type metal substrate, having multiple conductor element blanks and a carrier structure, is provided. Grooved depressions are produced on all peripheral surfaces of the blanks on a texturing section with one or two laser light sources. With a single laser light source the grooved depressions are produced on at least two primary peripheral surfaces which adjoin one another and form a common edge such that a multiplicity of the grooved depressions extends without interruption continuously into the primary peripheral surfaces. A conductor element blank is separated from the carrier structure. The resulting conductor element is encapsulated with plastic by injection molding on all peripheral surfaces within a section to be encapsulated. The plastic structure thereby formed extends into the grooved depressions.


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