The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2023

Filed:

Oct. 03, 2017
Applicant:

M Cubed Technologies, Inc., Newtown, CT (US);

Inventors:

Daniel Mastrobattisto, Southbury, CT (US);

Edward Gratrix, Monroe, CT (US);

Prashant Karandikar, Avondale, PA (US);

William Vance, Newtown, CT (US);

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 3/10 (2006.01); C04B 35/573 (2006.01); H01L 21/687 (2006.01); C04B 35/80 (2006.01); B24B 53/047 (2006.01); C30B 29/04 (2006.01);
U.S. Cl.
CPC ...
B24D 3/10 (2013.01); B24B 53/047 (2013.01); C04B 35/573 (2013.01); C04B 35/80 (2013.01); C30B 29/04 (2013.01); H01L 21/68757 (2013.01); C04B 2235/427 (2013.01); C04B 2235/428 (2013.01); C04B 2235/5436 (2013.01);
Abstract

Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height 'standing proud' above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.


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