The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
May. 19, 2022
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventor:
Go Hyun Lee, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); G11C 16/08 (2006.01); H10B 41/27 (2023.01); H01L 25/065 (2023.01); G11C 16/26 (2006.01); H10B 43/27 (2023.01);
U.S. Cl.
CPC ...
H10B 41/27 (2023.02); G11C 5/025 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01); H01L 25/0657 (2013.01); H10B 43/27 (2023.02);
Abstract
A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first chip configured to include a peripheral circuit, and a second chip stacked on the first chip that is configured to include a first memory cell array and a second memory cell array. A plurality of transfer circuits are configured to connect a plurality of row lines of the first memory cell array and a plurality of row lines of the second memory cell array to respective global row lines is divided between the first chip and the second chip.