The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jan. 25, 2022
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

So Ree Yoo, Suwon-si, KR;

Seung Eun Lee, Suwon-si, KR;

Joo Hwan Jung, Suwon-si, KR;

Yong Hoon Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/112 (2013.01); H05K 1/183 (2013.01); H05K 2201/096 (2013.01);
Abstract

A printed circuit board includes: a first substrate including a first cavity and first circuit units; and a second substrate disposed in the first cavity of the first substrate with an electronic component disposed therein, and including second circuit units having a higher density than the first circuit units, wherein the second substrate includes a first region and a second region, the first region of the second substrate includes an outermost circuit layer among the second circuit units, and circuit layers in the first region of the second substrate have a higher density than circuit layers in the second region of the second substrate.


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