The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Dec. 28, 2022
Applicant:
Daikin Industries, Ltd., Osaka, JP;
Inventors:
Masahide Fujiwara, Osaka, JP;
Nobuyasu Hiraoka, Osaka, JP;
Keito Kotera, Osaka, JP;
Taku Itou, Osaka, JP;
Masaki Kouno, Osaka, JP;
Reiji Kawashima, Osaka, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02M 7/537 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H02M 7/003 (2013.01); H05K 1/181 (2013.01); H05K 7/209 (2013.01); H05K 2201/10015 (2013.01);
Abstract
To achieve high density integration of components while securing an insulation distance between a bootstrap capacitor and an intelligent power module. In a printed wiring board, a region where a capacitor is mounted is located in a region where an intelligent power module is mounted. Therefore, the capacitor mounted on the printed wiring board is placed between the printed wiring board and the intelligent power module.