The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Dec. 16, 2021
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Karl Weidner, Munich, DE;

Ralph Wirth, Lappersdorf, DE;

Axel Kaltenbacher, Ingolstadt, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Oliver Wutz, Regensburg, DE;

Jan Marfeld, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 23/31 (2006.01); H01L 31/0232 (2014.01); H01L 33/60 (2010.01); H01L 31/0203 (2014.01); H01L 33/56 (2010.01); H01L 25/04 (2023.01); H01L 31/02 (2006.01); H01L 33/50 (2010.01); H01L 31/18 (2006.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 23/3107 (2013.01); H01L 23/3185 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/0232 (2013.01); H01L 31/02322 (2013.01); H01L 31/02327 (2013.01); H01L 31/1892 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.


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