The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Apr. 05, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sang-Hoon Kim, Seongnam-si, KR;

Min-Geun Kwon, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 24/05 (2013.01); H01L 27/14623 (2013.01); H01L 27/14685 (2013.01); H01L 24/06 (2013.01); H01L 27/14621 (2013.01); H01L 27/14634 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/06181 (2013.01);
Abstract

An image sensor includes a substrate including a pixel region and a pad region and having a first surface and a second surface opposite to the first surface, the pad region of the substrate being provided with a first recess which is recessed to a first depth from the second surface toward the first surface and the pixel region of the substrate being provided with a plurality of unit pixels, an interlayer insulating layer disposed on the first surface, an interconnection line disposed in the interlayer insulating layer, a conductive pad disposed in the first recess of the pad region, and a plurality of penetration structures disposed in the pad region of the substrate and extending from a bottom surface of the first recess to the first surface of the substrate, and electrically connecting the conductive pad to the interconnection line.


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